—采用全自动系统，从后磨到贴装的连续过程
GDM300晶圆研磨（Wafer Grinding）特长：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
采用全自动系统，从后磨到贴装的连续过程，可研磨至25um厚度。
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
2个磨头阶段，产量几乎是1个磨头系统的两倍。
·Built in edge trimming system is available as an option for thin wafer process.
内置修边系统可作为薄型晶圆加工的选择。
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
双指标体系，抛光阶段和研磨阶段完全分离，满足TSV和MEMS工艺所需的清洁。
·Less than Ra1A ultra luminance, ultra mirror surface is possible.
超亮度小于Ra1A，可超镜面。
GDM300晶圆研磨（Wafer Grinding）相关产品：
衡鹏供应
GNX200BP晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding